Magnetic components

ABSTRACT

Disclosed is an apparatus and method for a magnetic component. The magnetic component includes a substrate having a feature and a first conductive pattern disposed on the feature. The magnetic component also includes a permeability material disposed within the feature. A substrate material is disposed on the substrate to facilitate substantial enclosure of the permeability material between the substrate and the substrate material, where the substrate material has a second conductive pattern. The first conductive pattern and the second conductive pattern cooperate to be capable of facilitating magnetic properties of the permeability material.

BACKGROUND

1. Technical Field

The disclosure generally relates to magnetic components.

2. Information

Wide range of electronic devices may have various magnetic components.Magnetic components may be capable of providing various functions. Forexample, magnetic components in electronic devices may function astransformers, inductors, filters, and so forth.

Commonly, in order to have magnetic properties, magnetic components maycomprise of an assembly of one or more wires wound around a materialhaving permeability properties such as ferromagnetic material having atoroidal type shape, a rod type shape, etc. When a current is applied tothe one or more wires, the component may produce a magnetic field, whichmay be utilized to address a wide range of electrical needs associatedwith electronic devices.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments are illustrated by way of example and not by way oflimitation in the figures of the accompanying drawings, in which likereferences may indicate similar elements and in which:

FIG. 1 illustrates a perspective exploded view of a magnetic componentin accordance with one embodiment;

FIGS. 2A-2B illustrate a top view and a sectional view of a substratehaving a feature in accordance with one embodiment;

FIGS. 3A-3C illustrate a top view, a section view, and a detail view ofa substrate having a feature and a conductive pattern disposed withinthe feature in accordance with one embodiment;

FIG. 4 illustrates a perspective exploded view of a magnetic componentin accordance with another embodiment;

FIG. 5 illustrates a schematic of a magnetic component in accordancewith an embodiment;

FIG. 6 illustrates a schematic of a magnetic component in accordancewith another embodiment;

FIG. 7 illustrates a schematic of a magnetic component in accordancewith another embodiment;

FIG. 8 illustrates a schematic of a magnetic component in accordancewith another embodiment; and

FIG. 9 illustrates a flow chart of one embodiment of a process forproducing a magnetic component.

DETAILED DESCRIPTION

In the following description, embodiments will be disclosed. Forpurposes of explanation, specific numbers, materials, and/orconfigurations are set forth in order to provide a thoroughunderstanding of the embodiments. However, it will also be apparent tothose skilled in the art that the embodiments may be practiced withoutone or more of the specific details, or with other approaches,materials, components, etc. In other instances, well-known structures,materials, and/or operations are not shown and/or described in detail toavoid obscuring the embodiments. Accordingly, in some instances,features are omitted and/or simplified in order to not obscure thedisclosed embodiments. Furthermore, it is understood that theembodiments shown in the figures are illustrative representations andare not necessarily drawn to scale.

References throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, material, and/orcharacteristic described in connection with the embodiment is includedin at least one embodiment. Thus, the appearances of the phrases “in oneembodiment” and/or “in an embodiment” in various places throughout thisspecification are not necessarily all referring to the same embodiment.Furthermore, the particular features, structures, materials, and/orcharacteristics may be combined in any suitable manner in one or moreembodiments.

For the purposes of the subject matter disclosed herein, substrates mayinclude a wide range of substrates such as, but not limited to, plastictype substrates, metal type substrates, semiconductor type substrates,and so forth. Accordingly, it should appreciated by those skilled in theart that types of substrates may vary widely based at least in part onits application. However, for the purposes of describing the subjectmatter, references may be made to a substrate along with some exampletypes, but the subject matter is not limited to a type of substrate.Additionally, for the purposes of describing various embodiments,references may be made to magnetic components. However, it should beappreciated by those skilled in the relevant art that magneticcomponents may include a wide variety of magnetic components such as,but not limited to transformer type components, inductor typecomponents, filter type components, and so forth, and accordingly, theclaimed subject matter is not limited in scope in these respects.

Turning now to the figures, FIG. 1 illustrates a perspective explodedview of a magnetic component in accordance with one embodiment. As shownin FIG. 1, magnetic component 100 may comprise of a substrate 102 havinga first surface 104 and a feature 106. A first conductive pattern 108may be disposed on the feature 106. A permeability material 110 may bedisposed within the feature 106. Additionally, in the illustratedembodiment, a substrate material 112 may be disposed on the firstsurface 104 and on the feature 106, thereby forming a second surface114. Disposed on the second surface 114 may be a second conductivepattern 116. As will be further described in detail, first conductivepattern 108 and second conductive pattern 116 cooperate to be capable offacilitating magnetic properties of permeability material 110 inaccordance with various embodiments.

It should be appreciated that FIG. 1 illustrates an exploded view todescribe an embodiment of the claimed subject matter, and accordingly,as will be described in further detail, magnetic component 100 may havepermeability material 110 substantially enclosed within feature 106 withsubstrate material 112 substantially covering the permeability material110. First conductive pattern 106 and second conductive pattern 116 maysubstantially surround the permeability material, thereby forming awinding type relationship.

Continuing to refer to FIG. 1, substrate 102 is shown having asubstantially rectangular type shape. However, it should be appreciatedthat substrate 102 may have any type of shape such as, but not limitedto, substantially circular, substantially square, or any other type ofpolygonal shape. Additionally, substrate 102 may comprise of many typesof material such as, but not limited to, material suitable for printedcircuit boards (PCBs), various plastic type materials, material suitablefor injection molding and so forth. For example, in one embodiment,substrate 102 may comprise of a thermoplastic type material such as, butnot limited to, polyetherimide (PEI) type material. In anotherembodiment, substrate 102 may comprise of a resin type material that maybe suitable for injection type molding such as, but not limited to,liquid crystal polymer type material. It should be appreciated by thoseskilled in the relevant art that the shape and materials described aremerely examples, and the claimed subject matter is not limited in scopein these respects.

In FIG. 1, feature 106 is illustrated as a cup type feature below thefirst surface 104. That is, feature 106 may comprise of a depression inthe first surface 104 of substrate 102. Further, in the illustratedembodiment of FIG. 1, feature 106 may comprise of a toroidal type shapedepression below first surface 104 into the body of substrate 102.However, it should be appreciated by those skilled in the relevant artthat feature 106 may have a wide range of shapes such as, but notlimited to, a rod type shape, oblong type shape, and so forth, andaccordingly, the claimed subject matter is not limited in scope in theserespects.

A variety of approaches may be utilized in order to facilitate formationof feature 106. For example, in one embodiment, feature 106 may beformed by utilizing a lithography type process such as, but not limitedto photolithography. In another embodiment, feature 106 may be formed byutilizing a machining type process such as, but not limited to, amicromachining process. Various approaches may be utilized to facilitateformation of a feature, and accordingly, the claimed subject matter isnot limited to a particular approach.

As shown in FIG. 1, first conductive pattern 108 may be disposed in apattern around the inside of feature 106. In the illustrated embodiment,first conductive pattern 108 may be disposed in a manner whereby firstconductive pattern 108 substantially lines portions of the insidesurfaces of the feature 106. Here too, a variety of approaches may beutilized in order to dispose the first conductive pattern 108. In oneembodiment, first conductive pattern 108 may be disposed by utilizing astamping type approach such as, but not limited to, stamping aconductive pattern on a substrate. In another embodiment, firstconductive pattern 108 may be disposed by utilizing a plating typeapproach such as, but not limited to, chemical and/or electroplating aconductive pattern on a substrate. In another embodiment, firstconductive pattern 108 may be disposed by utilizing a lithography typeapproach such as, but not limited to, photolithography. In yet anotherembodiment, an structuring type approach such as, but not limited to,laser structuring type approach may be utilized to dispose firstconductive pattern 108. Various approaches may be utilized to dispose aconductive pattern, and accordingly, the claimed subject matter is notlimited to a particular approach.

First conductive pattern 108 may comprise of a wide variety of materialssuch as, but not limited to, copper, aluminum, gold, and various typesof conductive tracing materials. Accordingly, the claimed subject matteris not limited in scope in these respects.

Continuing to refer to FIG. 1, permeability material 110 is shown ashaving a shape based at least in part on the shape of the feature 106.That is, permeability material 110 may have a substantially toroidalshape that may substantially fit within the feature 106. In theembodiment of FIG. 1, permeability material 110 may be shown as aseparate solid object, where the solid object may be placed within thefeature 106 by various methods such as, but not limited to, utilizing apick and place machine. However, in another embodiment, permeabilitymaterial 110 may be of a liquid type form whereby the liquid type formmay be poured into a feature. In another embodiment, permeabilitymaterial 110 may be in the form of a powder type material whereby thepowder type material may be disposed into a feature. In yet anotherembodiment, permeability material 110 may comprise of material that maybe utilized with a vibration based type approach to facilitate placementof the permeability material substantially within the feature 106. Thatis, a method by which a vibration type machine may be utilized.Accordingly, the claimed subject matter is not limited in scope in theserespects.

Permeability material 110 may comprise of a wide variety of materialssuch as, but not limited to, ferromagnetic type materials that mayinclude ferrite type materials, iron type material, metal typematerials, metal alloy type materials, and so forth. Additionally,permeability material 110 may comprise of materials based at least inpart on the particular utilization of a magnetic component. For example,a magnetic component to be utilized as an isolation transformer mayinclude a permeability material having a relatively high permeability,such as, but not limited to 10000 Henry per meter. In another example, amagnetic component to be utilized as a common mode filter may include apermeability material having a moderate permeability such as, but notlimited to, 1000 Henry per meter. Further, as previously alluded to, thesize and shape of the permeability material 110 may be based at least inpart on the utilization of the magnetic component as well. Accordingly,the claimed subject matter is not limited in scope in these respects.

In FIG. 1, for the purposes of describing the embodiment, substratematerial 112 may be shown as a thin layer. However, the thin layer maybe representative of one or more layers of printed circuit layers to bedisposed on the first surface 104 of the substrate 102 and does notnecessarily denote a single piece of substrate material, but it alsocould be a single piece of substrate material. Additionally, thesubstrate material 112 does not necessarily need to substantially matchthe material of the substrate 102 and may be of a different material.For example, in one embodiment, the substrate material 112 may includevarious lamination layers that facilitate build up of circuit layers. Inanother embodiment, a liquid type material may be disposed on the on asubstrate such as, but not limited to, a liquid dielectric typematerial. For example, a liquid type dielectric type material may bedisposed by utilizing at least one of a spray type, roller type, and/ora squeegee type approach. It should be appreciated by those skilled inthe relevant art that the substrate material 112 may be disposed on thefirst surface 104 of the substrate 102 by a wide variety of approaches.Accordingly, the claimed subject matter is not limited to any oneparticular approach.

In the embodiment illustrated in FIG. 1, second conductive pattern 116is shown on the second surface 114 of substrate material 112. However,as previously described, second conductive pattern 116 may be disposedon the substrate material 112 utilizing a variety of approaches such as,but not limited to, a lamination approach, lithography approach, etchingapproach, a screen printing type approach, a laser structuring typeapproach, and so forth. That is, second conductive pattern 116 may bedisposed as part of the process of providing substrate material 112, andaccordingly, the claimed subject matter is not limited in theserespects.

In the embodiment of FIG. 1, second conductive pattern 116 substantiallymatches the pattern of the first conductive pattern 108 to facilitatewrapping of the permeability material 110 between the first conductivepattern 108 and the second conductive pattern 116. Additionally, firstconductive pattern 108 and second conductive pattern 116 may beelectrically coupled by various vias and/or interconnects as will bedescribed in detail. Together, first conductive pattern 108 and thesecond conductive pattern 116 cooperate to be capable of facilitatingmagnetic properties of the permeability material 110. For example, firstconductive pattern 108 and second conductive pattern 116 may cooperateto be capable of inducing a magnetic field upon the permeabilitymaterial 110.

FIGS. 2A-2B illustrate a top view and a sectional view of a substratehaving a feature in accordance with one embodiment. In FIG. 2A, asubstrate 200 may have a surface 202 and a feature 204. As shown in FIG.2B, feature 204 may be formed into the substrate 204 below the surface202. In this embodiment, the feature 204 may have a substantiallytoroidal shape formed as a depression type feature into the substrate200. As previously described, feature 204 may be formed by utilizing awide variety of approaches and may have a variety of shapes, andaccordingly, the claimed subject matter is not limited in theserespects.

FIGS. 3A-3C illustrate a top view, a section view, and a detail view ofa substrate having a feature and a conductive pattern disposed withinthe feature in accordance with one embodiment. Referring to FIG. 3A, asubstrate 300 may have a surface 302, a feature 304, and a conductivepattern 306. As shown in FIG. 3A, feature 304 may have a substantiallytoroidal type shape, and correspondingly, conductive pattern 306 may bepatterned circumferentially around the feature 304 (i.e., a wheel typepattern radiating from the center of the toroid). Turning to FIG. 3B, inthe illustrated embodiment, conductive pattern 306 has a portion on thesurface 302 and partly covers the walls of the feature 304 (i.e.,feature areas below surface 302). Detail 308 is illustrated in FIG. 3C,where conductive pattern 306 is shown provided on surface 302, insidefeature 304, and back on surface 302.

As previously described, once the conductive pattern 306 is disposed onthe feature 304, a permeability material may be disposed within thefeature 304. A substrate material may be disposed on the surface 302having a second conductive pattern. Various conductive paths such as,but not limited to, vias and/or interconnects (not shown) may be formedand utilized to electrically couple the two conductive patterns, therebyforming a winding type structure around a permeability material.

FIG. 4 illustrates a perspective exploded view of a magnetic componentin accordance with another embodiment. In FIG. 4, similar to magneticcomponent 100 (shown in FIG. 1), magnetic component 400 may include asubstrate 400, a first surface 404, a feature 406, a first conductivepattern 408, a substrate material 410, a second surface 412, and asecond conductive pattern 414. However, in this embodiment, apermeability material (not shown) may be relatively large based at leastin part on its application. Accordingly, a second feature 416 may beformed on the substrate material 410 to facilitate accommodation of thepermeability material. As shown, second conductive pattern 414 may bedisposed to at least partially cover the surfaces of the second feature416. As previously described, substrate material 410 may be disposed onthe substrate utilizing various approaches such as, but not limited to,a lamination type approach, where a sheet of substrate material having asecond feature may be disposed on a substrate. Alternatively, substratematerial may be disposed utilizing an etching type approach, where thesecond feature 416 may be the result of covering the permeabilitymaterial that extends out of the surface 404. Further, substratematerial may be disposed utilizing a spray type, roller type, and/or asqueegee type approach. Accordingly, the claimed subject matter is notlimited to a particular approach.

Here again, various approaches may be utilized for disposing conductivepatterns. For example, one such approach may be a lithography typeapproach utilizing various etching methods, and another approach may beto utilize a stamping type approach, a laser structuring type approach,and so forth.

Conductive patterns may be patterned to facilitate various magneticproperties for various magnetic components based at least in part ontheir applications. Further, because an approach that may be utilized inproviding the number of conductive patterns may be of a lithography typeapproach, laser structuring type approach, etc., precision of theconductive patterns may be relatively high based at least in part on thetype approaches utilized such as, but not limited to, a high aspectlithography approach of ultraviolet photolithography, and accordingly,the claimed subject matter is not limited to a particular approach.

In various embodiments, one or more magnetic components may be formed ona single substrate. Additionally, because the magnetic properties of amagnetic component may be based at least in part on its conductivepattern, its feature size, permeability material utilized, and/or soforth, more than a single type of magnetic component may be formed froma single substrate, and accordingly, the claimed subject matter is notlimited in these respects.

Examples of magnetic components may include a magnetic componentincluding a substrate having a feature, a first conductive pattern, apermeability material, a substrate material, and a second conductivepattern, where the first conductive pattern and the second conductivepattern cooperate to be capable of facilitating magnetic properties ofthe permeability material for various applications. Various applicationsmay include applications such as, but not limited to a dual common modefilter, a single common mode filter, a single inductor, an isolationtransformer, and so forth, and accordingly, the claimed subject matteris not limited in these respects. Various embodiments of variousmagnetic components, without limitations, may be illustrated in FIGS.5-8.

Turning now to FIG. 5, a magnetic component 500 may include a substrate(not shown) having a feature 502, a first conductive pattern 504, apermeability material 506, a substrate material (not shown), and asecond conductive pattern 508. The first conductive pattern 504 and thesecond conductive pattern 508 cooperate to be capable of facilitatingmagnetic properties of the permeability material 506, and in thisparticular embodiment, magnetic component 500 may be capable of beingutilized as a dual common mode filter (i.e., a common mode filter typefunctionality) as shown by related circuit illustration 510. It shouldbe appreciated that the substrate and substrate material are not shownin order to better illustrate the embodiment.

FIG. 6 illustrates a schematic of a magnetic component in accordancewith another embodiment. In FIG. 6, magnetic component 600 may include asubstrate (not shown) having a feature 602, a first conductive pattern604, a permeability material 606, a substrate material (not shown), anda second conductive pattern 608. The first conductive pattern 604 andthe second conductive pattern 608 cooperate to be capable offacilitating magnetic properties of the permeability material 606, andin this particular embodiment, magnetic component 600 may be capable ofbeing utilized as a single common mode filter (i.e., a single commonmode filter functionality) as shown by related circuit illustration 610.

FIG. 7 illustrates a schematic of a magnetic component in accordancewith another embodiment. In FIG. 7, magnetic component 700 may include asubstrate (not shown) having a feature 702, a first conductive pattern704, a permeability material 706, a substrate material (not shown), anda second conductive pattern 708. The first conductive pattern 704 andthe second conductive pattern 708 cooperate to be capable offacilitating magnetic properties of the permeability material 706, andin this particular embodiment, magnetic component 700 may be capable ofbeing utilized as a single inductor (i.e., an inductor typefunctionality) as shown by related circuit illustration 710.

FIG. 8 illustrates a schematic of a magnetic component in accordancewith another embodiment. In FIG. 8, magnetic component 800 may include asubstrate (not shown) having a feature 802, a first conductive pattern804, a permeability material 806, a substrate material (not shown), anda second conductive pattern 808. The first conductive pattern 804 andthe second conductive pattern 808 cooperate to be capable offacilitating magnetic properties of the permeability material 806, andin this particular embodiment, magnetic component 800 may be capable ofbeing utilized as an isolation transformer (i.e., a transformer typefunctionality) as shown by related circuit illustration 810.

FIG. 9 illustrates a flow chart of one embodiment of a process forproducing a magnetic component. As illustrated by flow chart 900 in FIG.9, the process may start by providing a substrate, as indicated by block902. As previously described, substrate may be of wide variety ofmaterials that may be utilized to PCBs. Further, substrate may have afeature formed on the substrate utilizing a wide variety of approachesas previously described.

In the embodiment of FIG. 9, a first conductive pattern may be disposedover the feature and the substrate, as indicated by block 904.

At block 906, a permeability material may be disposed within thefeature. A substrate material may be disposed over the permeabilitymaterial and the substrate at block 908. At block 910, a secondconductive pattern may be disposed on the substrate material, therebyfacilitating a winding of the conductive patterns around thepermeability material.

While there has been illustrated and/or described what are presentlyconsidered to be example embodiments of claimed subject matter, it willbe understood by those skilled in the art that various othermodifications may be made, and/or equivalents may be substituted,without departing from the true scope of claimed subject matter.Additionally, many modifications may be made to adapt a particularsituation to the teachings of claimed subject matter without departingfrom subject matter that is claimed. Therefore, it is intended that thepatent not be limited to the particular embodiments disclosed, but thatit covers all embodiments falling within the scope of the appendedclaims.

1. An apparatus comprising: a substrate, the substrate having a featureand a first conductive pattern disposed on the feature; a permeabilitymaterial disposed within the feature; a substrate material disposed onthe substrate to facilitate substantial enclosure of the permeabilitymaterial between the substrate and the substrate material, the substratematerial having a second conductive pattern, wherein the firstconductive pattern and the second conductive pattern cooperate to becapable of facilitating magnetic properties of the permeabilitymaterial.
 2. The apparatus of claim 1, wherein the substrate comprises athermoplastic type material.
 3. The apparatus of claim 2, wherein thethermoplastic type material comprises a polyetherimide type material. 4.The apparatus of claim 1, wherein the substrate comprises a resin typematerial.
 5. The apparatus of claim 4, wherein the resin type materialcomprises a liquid crystal type material.
 6. The apparatus of claim 1,wherein the feature comprises a feature having a toroidal type shape. 7.The apparatus of claim 1, wherein the feature comprises a feature formedby utilization of a machining type process.
 8. The apparatus of claim 1,wherein the feature comprises a feature formed by utilization of alithography type process.
 9. The apparatus of claim 1, wherein the firstconductive pattern comprises a conductive pattern that substantiallylines portions of inside surfaces of the feature.
 10. The apparatus ofclaim 1, wherein the first conductive pattern comprises a conductivepattern disposed by utilization of a stamping type approach.
 11. Theapparatus of claim 1, wherein the first conductive pattern comprises aconductive pattern disposed by utilization of a plating type approach.12. The apparatus of claim 1, wherein the first conductive patterncomprises a conductive pattern disposed by utilization of a laserstructuring type approach.
 13. The apparatus of claim 1, wherein thepermeability material comprises a ferromagnetic type material.
 14. Theapparatus of claim 1, wherein the permeability material comprises aseparate solid object that substantially matches a shape of the feature.15. The apparatus of claim 1, wherein the permeability materialcomprises a liquid type form material.
 16. The apparatus of claim 1,wherein the permeability material comprises a powder type material. 17.The apparatus of claim 1, wherein the permeability material comprises amaterial utilized with a vibration based type approach.
 18. Theapparatus of claim 1, wherein the substrate material comprises one ormore lamination layers.
 19. The apparatus of claim 18, wherein the oneor more lamination layers comprises one or more circuit layers.
 20. Theapparatus of claim 1, wherein the substrate material comprises a liquiddielectric type material.
 21. The apparatus of claim 20, wherein theliquid dielectric type material comprises a liquid dielectric materialdisposed by utilization of at least one of a spray type, roller type,and/or a squeegee type approach.
 22. The apparatus of claim 1, whereinthe substrate material comprises a substrate material having the secondconductive pattern disposed as part of a process of disposing thesubstrate material.
 23. The apparatus of claim 1 further comprising thefirst and second conductive material facilitating a winding typestructure around the permeability material.
 24. The apparatus of claim 1further comprising vias between the first conductive pattern and thesecond conductive pattern.
 25. The apparatus of claim 1 furthercomprising interconnects between the first conductive pattern and thesecond conductive pattern.
 26. The apparatus of claim 1, wherein themagnetic properties of the permeability material comprise magneticproperties capable of facilitating a common mode filter typefunctionality.
 27. The apparatus of claim 1, wherein the magneticproperties of the permeability material comprise magnetic propertiescapable of facilitating an inductor type functionality.
 28. Theapparatus of claim 1, wherein the magnetic properties of thepermeability material comprise magnetic properties capable offacilitating a transformer type functionality.
 29. A method comprising:forming a feature on a substrate; disposing a first conductive patternon the substrate and the feature; disposing a permeability materialwithin the feature; disposing a substrate material on the substrate andthe feature; and disposing a second conductive pattern on the substratematerial, wherein the first conductive pattern and the second conductivepattern cooperate to be capable of facilitating magnetic properties ofthe permeability material.
 30. The method of claim 29, wherein formingthe feature comprises machining a feature on the substrate.
 31. Themethod of claim 29, wherein forming the feature comprises molding afeature on the substrate.
 32. The method of claim 29, wherein formingthe feature comprises forming a feature utilizing a lithography typeprocess.
 33. The method of claim 29, wherein disposing the firstconductive pattern comprises stamping a first conductive pattern. 34.The method of claim 29, wherein disposing the first conductive patterncomprises plating a first conductive pattern.
 35. The method of claim29, wherein disposing the first conductive pattern comprises utilizing alithography type approach.
 36. The method of claim 29, wherein disposingthe first conductive pattern comprises a laser structuring typeapproach.
 37. The method of claim 29, wherein disposing a permeabilitymaterial comprises utilizing a pick and place machine.
 38. The method ofclaim 29, wherein disposing a permeability material comprises utilizinga vibration type machine.
 39. The method of claim 29, wherein disposingthe substrate material comprises laminating a substrate material. 40.The method of claim 29, wherein disposing the substrate materialcomprises at least one of spraying, rolling, and/or squeegeeing a liquidtype dielectric type material.
 41. The method of claim 29, whereindisposing the second conductive pattern comprises stamping a secondconductive pattern.
 42. The method of claim 29, wherein disposing thesecond conductive pattern comprises plating a second conductive pattern.43. The method of claim 29 further comprising forming vias toelectrically couple the first conductive pattern and the secondconductive pattern.